ZEPTO MICROWAVE AND CHIP DEVICES ASSEMBLY LLP
NBD Company Number：NBDX1H147590709
The latest trade data of this company is 2025-04-02
INDIA Importer/Exporter
Data Source：Customs Data
Records：18 Buyers：3 Suppliers：4
Related Product HS Code： 84864000 84869000
Related Trading Partners: JFP MICROTECHNIC , UNITEMP GMBH , HESSE ASIA LTD. MORE
ZEPTO MICROWAVE AND CHIP DEVICES ASSEMBLY LLP was included in the global trader database of NBD Trade Data on 2022-08-19. It is the first time for ZEPTO MICROWAVE AND CHIP DEVICES ASSEMBLY LLP to appear in the customs data of the INDIA，and at present, NBD Customs Data system has included 18 customs import and export records related to it, and among the trade partners of ZEPTO MICROWAVE AND CHIP DEVICES ASSEMBLY LLP, 3 procurers and 4 suppliers have been included in NBD Trade Data.
| Year | Import/Export | Partner Count | Category Count | Region Count | Entries Total | Total Value |
|---|---|---|---|---|---|---|
| 2024 | Import | 1 | 1 | 1 | 1 | 0 |
| 2023 | Export | 2 | 2 | 1 | 4 | 0 |
| 2023 | Import | 2 | 2 | 1 | 3 | 0 |
| 2022 | Import | 1 | 2 | 1 | 6 | 0 |
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Using NBD Trade Data can help the users comprehensively analyze the main trade regions of ZEPTO MICROWAVE AND CHIP DEVICES ASSEMBLY LLP , check the customs import and export records of this company in NBD Trade Data System till now, master the upstream and downstream procurers and suppliers of this company, find its new commodities procured or supplied, search the contact information of ZEPTO MICROWAVE AND CHIP DEVICES ASSEMBLY LLP and the procurement decision maker's E-mail address. NBD Trade Data System is updated once every three days. At present, the latest trade data of this company have been updated until 2025-04-02.
Recent customs import and export records of ZEPTO MICROWAVE AND CHIP DEVICES ASSEMBLY LLP are as follows:
| Date | Imp & Exp | HS CODE | Product Description | Country | Imp or Exp Company | Details |
|---|---|---|---|---|---|---|
| 2025-02-25 | Import | 70200090 | V015.06-4868 150MM WAFER, SEMICONDUCTOR GRADE QUARTZ ,DIAMETER: 150.0 +-0.3 MM ,THICKNESS: 975 +-10 uMV015.06-4868 150MM WAFER, SEMICONDUCTOR GRADE QUARTZ ,DIAMET | GERMANY | P***G | More |
| 2024-07-11 | Import | 84864000 | WB-300-U WIRE BONDER FOR WEDGE S/N:104 | GERMANY | U***H | More |
| 2023-11-07 | Import | 84864000 | BONDJET BJ855 HIGH SPEED THIN WIRE WEDGE/WEDGE BONDER WITH HEATED WORKHOLDER S.NO.BJ855-0607 WITH ACCESSORIES | GERMANY | H***. | More |
| 2023-09-29 | Import | 84864000 | BONDJET BJ855 HIGH SPEED THIN WIRE WEDGE/WEDGE BONDER WITH MANUAL WORKHOLDER WITHOUT HEATING S.NO.BJ855-0595 WITH ACCESS | GERMANY | H***. | More |
| 2023-08-24 | Import | 84798999 | WB-300-U WIRE BONDER FOR WEDGE S.NO.102 WITH SPARE PARTS / ACCESSORIES / COMPONENT | GERMANY | U***H | More |