DINGSHENG INTERNATIONAL CO , LTD.
DINGSHENG INTERNATIONAL CO , LTD. was included in the global trader database of NBD Trade Data on 2021-02-24. It is the first time for DINGSHENG INTERNATIONAL CO , LTD. to appear in the customs data of the CHINA，and at present, NBD Customs Data system has included 954 customs import and export records related to it, and among the trade partners of DINGSHENG INTERNATIONAL CO , LTD., 24 procurers and 0 suppliers have been included in NBD Trade Data.
| Year | Import/Export | Partner Count | Category Count | Region Count | Entries Total | Total Value |
|---|---|---|---|---|---|---|
| 2025 | Export | 3 | 1 | 1 | 94 | 0 |
| 2024 | Export | 10 | 4 | 3 | 306 | 0 |
| 2023 | Export | 6 | 3 | 2 | 208 | 0 |
| 2022 | Export | 9 | 2 | 2 | 196 | 0 |
| 2021 | Export | 14 | 2 | 2 | 150 | 0 |
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Using NBD Trade Data can help the users comprehensively analyze the main trade regions of DINGSHENG INTERNATIONAL CO , LTD. , check the customs import and export records of this company in NBD Trade Data System till now, master the upstream and downstream procurers and suppliers of this company, find its new commodities procured or supplied, search the contact information of DINGSHENG INTERNATIONAL CO , LTD. and the procurement decision maker's E-mail address. NBD Trade Data System is updated once every three days. At present, the latest trade data of this company have been updated until 2025-12-15.
Recent customs import and export records of DINGSHENG INTERNATIONAL CO , LTD. are as follows:
| Date | Imp & Exp | HS CODE | Product Description | Country | Imp or Exp Company | Details |
|---|---|---|---|---|---|---|
| 2025-12-15 | Export | 38101000 | SOLDER CREAM S3X58-M406H(T), 500G/JAR (TP: TIN 82-88%, SILVER 2-3%, COPPER 0.1-1%, ,...) PASTES USED FOR THE TIN SOLDER IN THE CONNECTOR COMPONENTS TO ELECTRONIC CIRCUIT BOARDS. 100% BRAND NEW | VIETNAM | D***. | More |
| 2025-12-15 | Export | 38101000 | SOLDER CREAM S3X58-M500L, 500G/JAR (TP: TIN 82-88%, SILVER 2-3%, COPPER 0.1-1%, ,...) PASTES USED FOR THE TIN SOLDER IN THE CONNECTOR COMPONENTS TO ELECTRONIC CIRCUIT BOARDS . 100% BRAND NEW | VIETNAM | D***. | More |
| 2025-12-15 | Export | 38101000 | SOLDER CREAM RS3X70-M500, 500G/JAR (TP: TIN 82-88%, SILVER 2-3%, COPPER 0.1-1%, ,...) PASTES USED FOR THE TIN SOLDER IN THE CONNECTOR COMPONENTS TO ELECTRONIC CIRCUIT BOARDS . 100% BRAND NEW | VIETNAM | D***. | More |
| 2025-12-15 | Export | 38101000 | SOLDER CREAM RS3X58-M650-3, 500G/JAR (TP: TIN 82-88%, SILVER 2-3%, COPPER 0.1-1%, ,...) PASTES USED FOR THE TIN SOLDER IN THE CONNECTOR COMPONENTS TO ELECTRONIC CIRCUIT BOARDS . 100% BRAND NEW | VIETNAM | D***. | More |
| 2025-11-27 | Export | 38101000 | SOLDER CREAM S3X58-M500, 500G/JAR (TP: TIN 82-88%, SILVER 2-3%, COPPER 0.1-1%,...) PASTES USED FOR THE TIN SOLDER IN THE CONNECTOR COMPONENTS TO ELECTRONIC CIRCUIT BOARDS.100% BRAND NEW, (LINE 04, TK 107429975220/C11) | VIETNAM | D***. | More |